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? semiconductor components industries, llc, 2010 february, 2010 ? rev. 0 1 publication order number: 7wbd3125/d 7wbd3125 2-bit translating bus switch the 7wbd3125 is an advanced high ? speed low ? power 2 ? bit translating bus switch in ultra ? small footprints. features ? high speed: t pd = 0.25 ns (max) @ v cc = 4.5 v ? 3 switch connection between 2 ports ? power down protection provided on inputs ? zero bounce ? ttl ? compatible control inputs ? ultra ? small pb ? free packages ? these are pb ? free devices this document contains information on some products that are still under development. on semiconductor reserves the right to change or discontinue these products without notice. http://onsemi.com see detailed ordering and shipping information in the package dimensions section on p age 6 of this data sheet. ordering information marking diagrams 1 ullga8 1.45 x 1.0 case 613aa 1 ullga8 1.6 x 1.0 case 613ab 1 ullga8 1.95 x 1.0 case 613ac 2m ahm ajm udfn8 mu suffix case 517aj 1 8 afm 1 8 ae m 1 uqfn8 mu suffix case 523an us8 us suffix case 493 1 8 aa m (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location. a = assembly location y = year w = work week m = date code = pb ? free package d125 ayw 1 8 micro8 dm suffix case 846a
7wbd3125 http://onsemi.com 2 oe1 1v cc a1 gnd 2 3 8 7 6 45 b2 oe2 b1 a2 figure 1. ullga8/udfn8 (top thru ? view) figure 2. uqfn8 (top thru ? view) 123 4 765 8 oe2 b1 a2 a1 b2 v cc gnd figure 3. us8/micro8 (top view) oe1 a1 gnd b2 v cc oe2 b1 a2 oe1 1 2 3 4 8 7 6 5 figure 4. logic diagram a1 oe1 b1 a2 oe2 b2 function table input oen function l bn = an h disconnect
7wbd3125 http://onsemi.com 3 maximum ratings symbol parameter value unit v cc dc supply voltage ? 0.5 to +7.0 v v in control pin input voltage ? 0.5 to +7.0 v v i/o switch input / output voltage ? 0.5 to +7.0 v i ik control pin dc input diode current v in < gnd ? 50 ma i ok switch i/o port dc diode current v i/o < gnd ? 50 ma i o on ? state switch current 128 ma continuous current through v cc or gnd 150 ma i cc dc supply current per supply pin 150 ma i gnd dc ground current per ground pin 150 ma t stg storage temperature range ? 65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance us8 (note 1) udfn8 uqfn8 ullga8 micro8 251 111 208 455 392 c/w p d power dissipation in still air at 85 c us8 udfn8 uqfn8 ullga8 micro8 498 1127 601 274 319 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body mode (note 2) machine model (note 3) charged device model (note 4) > 2000 > 200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 5) 200 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ounce copper trace no air flow. 2. tested to eia / jesd22 ? a114 ? a. 3. tested to eia / jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. 5. tested to eia / jesd78. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage 4.0 5.5 v v in control pin input voltage 0 5.5 v v i/o switch input / output voltage 0 5.5 v t a operating free ? air temperature ? 55 +125 c t / v input transition rise or fall rate control input switch i/o 0 0 5 dc ns/v
7wbd3125 http://onsemi.com 4 dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = ? 55 c to +125 c unit min typ max min max v ik clamp diode voltage i i/o = ? 18 ma 4.5 ? 1.2 ? 1.2 v v ih high ? level input voltage (control) 4.0 to 5.5 2.0 2.0 v v il low ? level input voltage (control) 4.0 to 5.5 0.8 0.8 v v oh output voltage high see figure 5 i in input leakage current 0 v in 5.5 v 5.5 0.1 1.0 a i off power off leakage current v i/o = 0 to 5.5 v 0 0.1 1.0 a i cc quiescent supply current i o = 0, v in = v cc or 0 v oe1 = oe2 = gnd oe1 = oe2 = v cc 5.5 1.0 0.1 1.0 1.0 ma a i cc increase in supply current (control pin) one input at 3.4 v; other inputs at v cc or gnd 5.5 2.5 ma r on switch on resistance v i/o = 0, i i/o = 64 ma i i/o = 30 ma 4.5 3 3 7 7 7 7 v i/o = 2.4, i i/o = 15 ma 15 50 50 v i/o = 2.4, i i/o = 15 ma 4.0 50 70 70 ac electrical characteristics symbol parameter test condition v cc (v) t a = 25 c t a = ? 55 c to +125 c unit min typ max min max t pd propagation delay, bus to bus see figure 6 4.0 to 5.5 0.25 0.25 ns t en output enable time see figure 6 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 ns 4.0 0.8 3.0 4.6 0.8 4.6 t dis output disable time 4.5 to 5.5 0.8 3.0 4.8 0.8 4.8 ns 4.0 0.8 2.9 4.4 0.8 4.4 c in control input capacitance v in = 5 or 0 v 5.0 2.5 pf c io(on) switch on capacitance switch on 5.0 10 pf c io(off) switch off capacitance switch off 5.0 5 pf
7wbd3125 http://onsemi.com 5 typical dc characteristics figure 5. output voltage high vs supply voltage v cc , supply voltage (v) v oh , high level output voltage (v) 3.75 3.50 3.25 3.00 2.75 2.50 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 i oh = ? 0.1 ma ? 6 ma ? 12 ma ? 24 ma v cc , supply voltage (v) v oh , high level output voltage (v) 3.75 3.50 3.25 3.00 2.75 2.50 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 i oh = ? 0.1 ma ? 6 ma ? 12 ma ? 24 ma v cc , supply voltage (v) v oh , high level output voltage (v) 3.75 3.50 3.25 3.00 2.75 2.50 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 i oh = ? 0.1 ma ? 6 ma ? 12 ma ? 24 ma t a = +85 c v in = v cc t a = +25 c v in = v cc t a = ? 40 c v in = v cc
7wbd3125 http://onsemi.com 6 ac loading and waveforms parameter measurement information c l = 50 pf* from output under test gnd open 7 v 500 s1 *c l includes probes and jig capacitance. 500 test s1 t pd open t plz /t pzl 7 v t phz /t pzh open voltage waveforms propagation delay times voltage waveforms enable and disable times 3.5 v output control 3 v 0 v 1.5 v 1.5 v 1.5 v 1.5 v t pzh t phz v ol v oh 0 v output output waveform 1 s1 at 7 v (note 6) waveform 2 s1 at open (note 6) v ol + 0.3 v v oh ? 0.3 v 6. waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 7. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , t r 2.5 ns, t f 2.5 ns. 8. the outputs are measured one at a time, with one transition per measurement. 9. t plz and t phz are the same as t dis . 10. t pzl and t pzh are the same as t en . 11. t phl and t plh are the same as t pd . figure 6. t pd , t en , t dis loading and waveforms 1.5 v 1.5 v 1.5 v 1.5 v input output v oh v ol t phl t plh 3 v 0 v t pzl t plz ordering information device package shipping ? 7wbd3125usg us8 (pb ? free) 3000 / tape & reel 7wbd3125mutag udfn8 (pb ? free) 3000 / tape & reel 7WBD3125AMUTCG uqfn8 (pb ? free) 3000 / tape & reel (in development) 7wbd3125amx1tcg ullga8 ? 0.5 mm pitch (pb ? free) 3000 / tape & reel (in development) 7wbd3125bmx1tcg ullga8 ? 0.4 mm pitch (pb ? free) 3000 / tape & reel (in development) 7wbd3125cmx1tcg ullga8 ? 0.35 mm pitch (pb ? free) 3000 / tape & reel (in development) 7wbd3125dmr2g micro8 (pb ? free) 4000 / tape & reel (in development) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
7wbd3125 http://onsemi.com 7 package dimensions udfn8 1.8 x 1.2, 0.4p case 517aj ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from terminal tip. 4. mold flash allowed on terminals along edge of package. flash may not exceed 0.03 onto bottom surface of terminals. 5. detail a shows optional construction for terminals. a b e d bottom view b e 8x b a c c note 3 0.10 c pin one reference top view 0.10 c a a1 (a3) 0.05 c 0.05 c c seating plane side view l 8x 1 4 5 8 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.80 bsc e 1.20 bsc e 0.40 bsc l 0.45 0.55 e/2 b2 0.30 ref l1 0.00 0.03 l2 0.40 ref detail a (l2) (b2) note 5 l1 detail a m 0.10 m 0.05 0.22 0.32 8x 1.50 0.40 pitch 0.66 dimensions: millimeters mounting footprint* 7x 1 soldermask defined *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
7wbd3125 http://onsemi.com 8 package dimensions ullga8 1.45x1.0, 0.35p case 613aa ? 01 issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 8x 0.10 b 0.05 a c c l 7x note 3 0.10 c pin one reference top view 0.10 c 8x a a1 0.05 c 0.05 c c seating plane side view l1 1 4 5 8 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 e/2 note 4 soldermask defined* dimensions: millimeters 0.22 7x 0.48 8x 1.18 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.35 1 mounting footprint pkg outline
7wbd3125 http://onsemi.com 9 package dimensions ullga8 1.6x1.0, 0.4p case 613ab ? 01 issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 8x 0.10 b 0.05 a c c l 7x note 3 0.10 c pin one reference top view 0.10 c 8x a a1 0.05 c 0.05 c c seating plane side view l1 1 4 5 8 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.60 bsc e 1.00 bsc e 0.40 bsc l 0.25 0.35 l1 0.30 0.40 e/2 note 4 soldermask defined* dimensions: millimeters 0.26 7x 0.49 8x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.40 1 mounting footprint pkg outline
7wbd3125 http://onsemi.com 10 package dimensions ullga8 1.95x1.0, 0.5p case 613ac ? 01 issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 8x 0.10 b 0.05 a c c l 7x note 3 0.10 c pin one reference top view 0.10 c 8x a a1 0.05 c 0.05 c c seating plane side view l1 1 4 5 8 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.95 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 e/2 note 4 soldermask defined* dimensions: millimeters 0.30 7x 0.49 8x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint pkg outline
7wbd3125 http://onsemi.com 11 package dimensions case 523an ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 8x 0.10 b 0.05 a c c note 3 2x 0.10 c pin one reference top view 2x 0.10 c a a1 (a3) 0.05 c 0.05 c c seating plane side view l 8x 1 3 5 8 dim min max millimeters a 0.45 0.60 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 1.60 bsc l1 ??? 0.15 e 1.60 bsc e 0.50 bsc l 0.35 0.45 l1 detail a ?? *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* pitch 0.35 7x dimensions: millimeters 1 7 l3 0.25 1.70 1.70 0.50 l3 0.25 0.35 l3 (0.10) (0.15) 8x 0.53 8x 0.53 8x
7wbd3125 http://onsemi.com 12 package dimensions us8 case 493 ? 02 issue b dim a min max min max inches 1.90 2.10 0.075 0.083 millimeters b 2.20 2.40 0.087 0.094 c 0.60 0.90 0.024 0.035 d 0.17 0.25 0.007 0.010 f 0.20 0.35 0.008 0.014 g 0.50 bsc 0.020 bsc h 0.40 ref 0.016 ref j 0.10 0.18 0.004 0.007 k 0.00 0.10 0.000 0.004 l 3.00 3.20 0.118 0.126 m 0 6 0 6 n 5 10 5 10 p 0.23 0.34 0.010 0.013 r 0.23 0.33 0.009 0.013 s 0.37 0.47 0.015 0.019 u 0.60 0.80 0.024 0.031 v 0.12 bsc 0.005 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. dimension ?a? does not include mold flash, protrusion or gate burr. mold flash. protrusion and gate burr shall not exceed 0.140 mm (0.0055?) per side. 4. dimension ?b? does not include inter ? lead flash or protrusion. inter ? lead flash and protrusion shall not e3xceed 0.140 (0.0055?) per side. 5. lead finish is solder plating with thickness of 0.0076 ? 0.0203 mm. (300 ? 800 ?). 6. all tolerance unless otherwise specified 0.0508 (0.0002 ?). l b a p g 4 1 5 8 c k d seating j s r u detail e v f h n r 0.10 typ m ? y ? ? x ? ? t ? detail e t m 0.10 (0.004) xy t 0.10 (0.004) plane *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* mm inches scale 8:1 3.8 0.15 0.50 0.0197 1.0 0.0394 0.30 0.012 1.8 0.07
7wbd3125 http://onsemi.com 13 package dimensions micro8 case 846a ? 02 issue h s b m 0.08 (0.003) a s t notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. 846a-01 obsolete, new standard 846a-02. b e pin 1 id 8 pl 0.038 (0.0015) ? t ? seating plane a a1 c l *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 8x 8x 6x mm inches scale 8:1 1.04 0.041 0.38 0.015 5.28 0.208 4.24 0.167 3.20 0.126 0.65 0.0256 dim a min nom max min millimeters ?? ?? 1.10 ?? inches a1 0.05 0.08 0.15 0.002 b 0.25 0.33 0.40 0.010 c 0.13 0.18 0.23 0.005 d 2.90 3.00 3.10 0.114 e 2.90 3.00 3.10 0.114 e 0.65 bsc l 0.40 0.55 0.70 0.016 ?? 0.043 0.003 0.006 0.013 0.016 0.007 0.009 0.118 0.122 0.118 0.122 0.026 bsc 0.021 0.028 nom max 4.75 4.90 5.05 0.187 0.193 0.199 h e h e d d e on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 7wbd3125/d micro8 is a trademark of international rectifier. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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